Die sorting system

ABSTRACT

A wafer of semiconductor devices is tested to determine the quality of each device. The test data with respect to each die is electro-optically encoded and photographically recorded in a pattern corresponding to the die pattern on the wafer. Upon completion of the testing and recording operations the wafer is scored, mounted on a flexible pressure-sensitive adhesive web and broken so as to separate the dies from one another while maintaining their original orientation. The dice and their respective test record are then mounted on a common frame, sideby-side, so that each die and its test data are readily matched. The frame is then mounted on a die-sorting mechanism comprised of an XY indexing table which indexes the wafer die by die through a removal station and the film indexed through an electro-optical reader where the test data is read out to designate the die to a selected delivery station.

" I i 1mm? 3 W A OTHER REFERENCES 1 m i v Drusehel, W. O: "Semiconductor Chip Tester and Sorter"- VlrgE!M:flln0tis.G!ou steq Johns. b g I Machine, W n Mn gepgeggy 364, IBM Lehmcal Disclosure Bulletin Vol. 6, No.

Am. No. 185,209 w Filed B6, R9, 1968 PmMry xaminer-Richard A. Schacher P g md g g, 1971' Attorney-Morse. Altman& Oates Assignee fiaueistor Autolaatiee Wohura. Mesa. e 1 a3; AEiE'ERACT: A wafer of semiconductor devices is tested to f ls. SYSTEM determine the quality of each device. The test data with n chm mum Ba; v 7 respect to each die [5 eIectro-opncally encoded and photol f *1 I graphically recorded in a pattern corresponding to the die i l 2 73. pattern on the wafer. Upon completion of the testing and 29I 3: 29l574.324fi58 recording operations the wafer is scored, mounted on a I L f 597C flexible pressuresensitive adhesive web and broken so as l to separate the dies from one another while maintaining l 5 ;3 ll their original orientation. The dice and their respective test I P record are then mounted on a common frame, side-by-side, L 2 6,]:

Cm so that each die and its test data are readily matched. The enacts frame is the} mounted on a die-sorting mechanisrn'compn'sed UNITED STATES PATENTS A v of an XY indexing table which indexes the wafer die by die 2,970;730 2/ l 96i Schwarz.....w.........;..... 29/413UX through a removal station and the film indexed thm'lighjtll V 3,36,604 11/1965 h'erriott 346/108X "electro-optical reader where the test data is read out to 3 562.53? 811969 Lotz 29/S83X designate the die to a selected delivery station. I '5 k l2 Rama); 0 YEST some:

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I 020005 ad TURRET MEMORY JMPROGRAM CONTROL READJ NDEX AND STORAGE BONDING FIG.

INVENTORS MDRDECHAI WiESLER VlRGiL MARTINONIS JOHN S. MACINTYRE ATTORNEYS sum 2 er .5

POWER ENCODER TEST SET X'Y TABLE FIG - ATTORNEYS msmzm 1 21 3,583. 561

SHEEI 3 BF 5 0 O OM92 A DEC ODE MEMORY lNVENTORS MORDECHN WIESLER VERGSL MARTINONES JOHN S. MACINTYRE J ATTORNEYS V Pmmmm 8m 3583561 "SHEETHUFS L L a n 86 24 m mz FIG. 5 A

res :68 no I INVENTORS 140156 I60 MORDECHAI WIESLER ViRGIL MARTlNONIS JOHN S. MACI NTYRE ATTORNEYS PATENTEUJUR m v 31583581 Y sum 5 m5 u 1241 me 1282 P 1 :24, {I26 I28 /A 1 DATA 3.3 l 4 jam l PARKING Y o F o O FEG. I2 PEG. rs,

V/A -COMPAR-1som 145 I i SIGNAL FOR vmeu. MA.. NONIS r! l- JOHN s. MACINTYRE coMmRlsom SIGNAL ,4 BY, FOR x DIRECTION HQ 14 7 QZ'J-OK,

ATTORNEYS y y Y DERECTION v y (NVENTORS O O T MORDECHAI ESLER D-[E SORTlNG YSTEM BACKGROUND OF THE IFJVENTIQPI 1. Field of thelnvention This invention relates generally to the classification and sorting of individual semicondnctive devices from monolithic wafers and more particularly is directed towards 'a new and improved method and associated apparatus for testing, sorting and packaging semiconductive dice from monolithic wafers.

2. History of the Prior Art In the production of semiconductivc devices from a monolithic wafer it has been necessary, by reason of the imperfect state of the art; to test and divide the dies from one wafer into categories of varying qualities and characteristics. While all devices on a given wafer are designed and intended to be identical, in practice a rat h cr wide variation appears in the quality of the when tested. Herelofore,thdsorting'ol the dies according to their characteristics wasiarried out in various ways. One such technique involved testing and a rking each device with ink in a color code and then physica ing the dies according to the color coding. Other techniques also have been employed but none have been entirely satisfac- I tory from the standpoint of speed of operation, cost and overall efficiency. Accordingly, it is an object of the present invention to provide a new and improved method and assedated apparatus for quickly, accurately and efficiently sorting individual semiconductive devices from a monolithic wafer. 4

4 SUMMARY OF THE lNVENTlON ployed to deliver each device to a preselected station where devices of commoncharacteristics are stored, acka ed or the This invention also features associated apparatus for sorting devices including an electro-optical system for producing a photographic record pattern in coded form corresponding to the characteristics of each die, a mounting and alignment stai tion by which the wafer and film are mounted-inside-hy-side registration and an electro-optical reading instrument by which the coded pattern on the film is read out to produce appropriate driving signals for the sorting'the apparatus. The sorting apparatus includes a novel separation apparatus for removing devices from the wafer film comprising cooperating and reciprocating vacuum collet and needle by which individual devices are separated from the film and an indexing table for depositing the devices at selected'stations.

BRlEFDESCRlPTlON OF THE DRAWINGS H6. 1 is a somewhat vschematic diagram of a die-sorting system made according to the invention,

HO. 2 is a cross-sectional view in side elevation, somewhat schematic, of an electro-cpticai system for producing a photo- H6. 5 is a view in end elevation of the sorting apparatus showing the film-reading apparatus of FIG. 4 plus details of the mechanism for removing individual dies from the pressure sensitive web, V

F lG.. 6 is a crosssectional view showing details of the pickoff mechanism of H0. 5 on an enlarged scale,

FIG. 7 is a view in side elevation-of the indexing mechanism which may be employed at each delivery station and made in accordance with the invention,

FIG. 8 is a detail perspective view showing a portion of a packaging tape made in accordance'with the invention, and,

FIGS. 9 through 14 illustrate code patterns employed in conjunction with this invention.

DETAlLED DESCRlPTlON OF THE PREFERRED EMBODIM ENT General Referring now to thedrawings and particularly to FlG. a

general description of the system will be given by way of introduction.

A monolithic wai er ill, comprised of a grid array of small semiconductive devices formed thereon. is mounted as by a vacuum chuck on the upper face of an Xi indexing table 12 adapted to move the wafer incrementally along mutually perpendicular X and Y axes so that by probes and associated test equipment, which are known in the art, each device may be tested to determine its particular operating characteristics and quality, and for this purpose a test set, generally indicated by block 14, is employed. Such test sets are commercially availabic and form no part of this invention per se. Test data from the set 14 are electro-opticaliy encoded by an electro-optical recording instrument $6 to be described more fully in conjunction with FIG. 2. in general. this instrument includes a member l8 extending from the XY table 12 so that it moves together with the wafer as it is indexed. The member carries an optical head 20 which is adapted to project onto a photographic film 22 a pattern that is coded in accordance with the test data obtained from the test set with respect to each individual circuit which as been probed. Since the film 22 is fixed in position the head 20 will index in the same manner as the wafer l0 producing multiple photographic images in a gridlike pattern, each image containing a photographic code corresponding to the characteristics of a particular circuit device in the wafer 10. When all of the devices in the wafer it) have been'probed'anh photographic record has been made of the film 22, the wafer 10 is removed from the XY table and mounted on the adhesi e face of a pressure sensitive adhesive web 24. The wafer is then scribed so as to form score lines in a grid pattern between each device on the wafer. The wafer is then broken into individual dies as by passing the wafer'and film over an edge as disclosed in copending application Ser. No. 665,635 entitled Method and Apparatus For Sorting Semiconductive Devices" filed Sept. 5, 1967, now US. Pat. No. 3,497,943 dated Mar. 3, i970, assigned to the same assignee. The dies are broken from one another while remaining attached to the web in their original position and orientation.

The film 22, in the meantime, is developed and both the photographic film 22 and web 26, with the wafer 10, are mounted in side-by-side alignment to a frame 26 formed with suitable apertures 28 and 30. The photo' raphic film and dice are assembled to the lframe'by an alignment and mounting instrument generally indicated in block form in FIG. 1 and shown in greater detail in FIG. 3. Once the components are assembled in precise relation so that the position of a particular die corresponds exactly with its corresponding photographic code on the film 22, the frame is transferred to a die-sorting instrument generally indicated in block form 34 in HO. 1 and shown in more detail in FIGS. 4, 5, 6 and 7. The die-sorter includes second XY table 36 to which the frame 26 is mounted. The sorter includes an electro-optical reading instrument, best shown in FlG. 4, including a stationary optical head 36 which reads each coded pattern on the film 22 as the frame 26 is indexed by the XY table. The XY table is located adjacent a transfer turret 38 having a plurality of radial pickoff heads 40 which remove individual dies from the pressure-sensitive web 24 and, in accordance with instructions fed from the electrooptical reader; delivers each die to one ofa plurality of radial delivery stations 42. which may have an automatic packaging unit, each station collecting dies having the same characteristics., Alternatively the sorted dies may be delivered directly to a die-bonding machine thereby avoiding the packaging requirements.

Electro-Optical Recorder Referring now to FIG- 2 of the drawings, the electro-optical recording instrument 16 will now be described in detail. The

recording instrument includes the extension member if; which is comprised of a pair of parallel tubes t2 and 44 rigidly secured to the 'XY table 12 so as to' move in unison with the wafer as it is probed. The tubes 42 and 44 are fixed rigidly at one end to the optical head 20. At their opposite ends the tubes are connected to independent light sources adapted to projectseparatc imagss along parallel paths to a beam-splitter 46 mounted in the optical head and adapted to direct the images in a reduced size downwardly through a lens 48 onto the photographic film 22. The film 22 preferably is mounted to a fixed vacuum chuck 50 adapted to hold the film flat against the planar supporting upper surface of the chuck.

The tube 42, as viewed in HG. 2. at its right-hand end is provided with a bulb 52 which is adapted to project a reference image 54 o nto the chuck surface 50 for focusing purposes only.

The tube 44 is providedwith anelectrooptical encoding unit 56 focused along the tube towards the beam splitter. This unit is comprised ofa bundle of light pipes 58 tapered towards the beam splitter and typically ten in number in a grouping such as shown in FlG. 2a. Each oi the light pipes is provided at its,righthand end with an individual light source such as a bulb 60 or thcjike. Each of the bulbs 60 is connected by a lead 62 to a power source 64 which in turn is controlled by the output from the test set M. Test set 14, as previously described. is

operatively connected to the probe .so that information derived as to the operating characteristics of each semiconductive device in the wafer 10 will be fed from the test set encodcd to the power source so as to i!lutninate the bulbs 56 i i gseiective patterns or coding arrangements corresponding to the particular characteristics of the devices tested on the wafer. it will be understood that by illuminating certain one or more of the bulbs 56, various code combinations may be produced which will be projected onto the film 22.

The projected image of the code pattern preferably has a perimeter that is equal toor smaller than the area size of the device that has bcen'tested. As the probe indexes the wafer from die to die the electro-optical encoder records the appropriate coded pattern on the film, the pattern corresponding to the test results of the respective die. Since the lilm'rccord is made at the same time as the test,:the arrangement of the coded test results on the film is similar to the gr d arrangement of the devices on the wafer. The film, therefore. provides the test result of every device on the wafer in a corresponding ar rangement. Typically, the ratio of the film to the wafer is one to one. The fiirn 22 is, of course, mounted within a light type enclosure whichjor sake of clarity, has not been illustrated.

When the testing of the wafer has been completed ands photographic record made'ol each and every device in the wafer, the film 22 is developed. The film 22 may be conventional photographic film or may be in the form of quick developing film such as sold by Polaroid Corporation. ln FIG. 2!; there is illustrated a plan view of a typical photographic record of the coded data corresponding to a wafer produced by the H6. 2 instrument. FlG. 2b also shows a portion of the fi m greatly enlarged to show details ofthe code pattern. lt will be understood that for each tested device the recording pattern for that device will be comprised of a group of 10 blocks 66 and in each gt oup of blocks some will be clear while others in a sorting instrument mechanism.

Mounting and Alignment Station The exposed and developed film 22 is next mounted to the frair9, 26 in sideby-side relation with the now divided dies which are held in their original orientation by means of the pre sure sensitive web 24 to which they have been transferred. The instrument employed for the mounting and alignment station is best shown in FlCr; 3 and is comprised ofa fixed frame 68 having a horizontal, dross support to which are mounted spaced magnifying viewers 70 and 72 each adapted to register one with the dies and the other with the film.

Mounted below the viewers 70 and 72 is a vacuum chuck i l carried by a manually operate-e positioning table 78 which is also angularly adjustable -'whereby the photographic record and the circuit dies may be Aligned precisely with one another and, when properly aligned, transferred to the mounting frame 26. In practice, the dies on the web are oriented into position and transferred to the mounting frame then the film record is oriented in a similar manner in relation to the dies and thereupon transferred to the mounting frame. The relative positions of the wafer dies and the test record on the mounting frame are such that ata fixed distance of X and Y fromany die, a reader can pick up the test results for that particular die.

Die-Sorting Station The mounted photographic record and dice array carr ed by the frame 26 are then transferred to the die-sorting apparatus 34. best shown in F165. 4, 5 and 6. The die sorter basically comprises the XY indcgging table 36 on which the mounting frame 26, supporting the correctly oriented dice and film record, is mounted; the optical reading head 36 for reading the coded data on the film 22; and the sorting turret 38 equipped with a plurality of vacuum collets 80. The XY table indexes in the same fashion as the XY table 12 for the recording instrument, indexing from one device and one code image to the next. It will be understood that the mounting frame 26 moves so that the photographic record and the dies index in unison. The mounting frame is positioned so that the film pendicularly tubes 82 and 84 extending from a beam splitter 86 located above a lens 88 focused on the coded film 22. The upper end of the tube 84 is provided with an eye piece 90 having a crosshair reticle and is used for visual alignment purposes. At the left'hand end of the tube 82. as viewed in FIG. 4, are two banks of photodiodes 92 and 94 which serve to convert a projected image of the photographic code to usable electrical signals. This coded image is projected by means of a light source, such as a bulb 96, located below the film 22 along the optical axis of the, lens 88. As the film 22. is indexed onto the optical axis of the lens 88 the coded pattern, which cor responding to the quality and characteristics of the particular I die. These electrical signals are fed to a shift register memory 98. Programmed data will stop the XY table 36 and a vacuum collet will pick up a desired die lflO while its address is en tered into the memory. The collet 80 is indexed with the sorting turret 33 andcarries the die until the col et arrives at a predetermined deposit station which may comprise a container or a packaging mechanism. In any event a plurality of these deposit stations are located in evenly spaced angular relation about the turret and when the collet with the die arrives at the correct station the die is deposited. A container or packaging unit is located at each receiving station and the dies are collected according to their categories.

The mechanism for separating the selected die from the pressure-sensitive web 24 is comprised ofa reciprocating needle 102 located below the web 24 for registration with a coilet 80 which indexes into and out of position above the wafer array as the turret 38 indexes. The needle 102 may be rcciprocated by any one of a variety of techniques such as a rotary earn, a pneumatic or hydraulic cylinder or by means of a solenoid. The needle isfformed with a slightly rounded tip which, upon reciprocation, comes up under each die I forcit upward away from the web and into a conical annular recess slightly larger than the die 109, formed in the f 'lc-wer end of the collet llfix Tlle collet S3 is formed with a centra! passage 166 connected to a vacuum source whereby when l an individual die 100 is transferred from the web to the collct it will be held there until subsequently deposited at a selected "deposit station.

is located on the outer end of a pair olparnllcl leaf springs 108 and lll'ifextcnding out from the turret and located below a radial arm-'71 12. The arm 122 is provided with an itpright plunger 134 which is adapted to engage an eccentric rotor 26 driven by a rotary solenoid H8. When the collet 86 is in-position over the selected die, a signal is sent to the solenoid causing the eccentric rotor 116 to rotate, this in turn :cazisingthe plunger I14 to be depressed, forcing the collct 80 down against the selected'die which is pushed up simultaneously by the needle. Contiiiued rotation of the rotor H6 permits the collet to retract with the die and the turret is then inf iexcd bringing the next collet 80 to bear above the next die which has been moved into position by tltGaXY table. when I the collet with its die reaches a preselected deposit station the die is released. a A small XY stage 111 isldrivingly connected to the optical i head 36 and 'operated by separate stepping, motors 123 and 115 for making minor corrections to the alignment between v I f. ,thelens and the code pattern as will presently appear.

,Optical Recording t 'The optical recording tI chniques employed in the system are somewhat similar to-rnultichannel magnetic tape recording. However, the technique herein employs photographic film to record light or darlci pots as logic signals which can be -st ':lred indefinitely and read out at will. A block of data is recorded in '1 fleldtypically 0.015 inches square. This field, shown enlarged inJ-"IG. 9, .is divided into two major areas g which may be defined as a=parking area 129 and a data area which the reading scannei' will rcst between indexes. Since reading is accomplished by'zlthree spots of an equivalent diame- Stencil 1' ro l the tolerancein indexing for eading is plus or 'minus 2 mils. in direction. The dataarea 122 is divided in'to three major rows 124; 126 and 128 in the direction of travel. when thetfilm passesunder the reading head 36, three sensors in either bank of photodiodes2 and 94 detect the variation between light and dark areas and issue the corj'responding signals in the appropriate channels. Channel allocation and res-ding head configurations are illustrated in F IG. .20. The technique used i he dataf readout i similar to the iv'RZltechnique (Non Re rn- -10 Zero Dunedin magnetic recording.

lrtithis method the detection system is used to detect light fchanges rather than light level. In other words, the system detects transitions from light dark or dark to light and signalsa f r transition as a logical! andi no transition as a logical 0. Therefore, the channels on the film record are the lines at which the transitions will occur. It is worthwhile noting that a transition is a logical I regardless of "is polarity, i.e. a change from light to dark or dark to light will both be a logical 1. ln FIG. 11 both A and 8 contain a logical l channel 2. However, A contains ,5: logical I) on channel 1 and a logical 1 on channel} while B contains a logical I on channel land: logical 0 on channel 3. Note that row 126 in H6 10 contains only one channel (channel 4) the other tw hannels being used for machine control purposes, the two blocks always being dark as shown.

Regarding is 'performed hile the film is stationary while J reading is done when th m is moving producing an AC 'jsignal. In order to maintai channel location regardless of the 1 direction oftravel, the reading circuitry will invert the signal ,7 sequence appropriately so that all the data appears in the same visual form."

TZZ. The parking area, as'fshown, is an area 5xl5 mils. in

banks )2 and 4 so that the leading bank is always reading'the data in a particular direction of travel. Switching between the two banks of sensors is performed automatically by the machine's logic. The timing signn. is generated by the first transition occurring in row I26. Since this block is always black and the parking area is always while this signal will appear in either direction of travel. This signal starts a master clock controlled by the oscillator driving the XY table thereby generating gating signals that are always in time with thetable speed. Turnaround signals are generated at each line and recorded as a block 145 in the parking area as shown in FIG. 5. Two blocks will appear in each line allowing an extra index so that data will not be lost a turnaround. During turnaround recording, data will not be recorded.

Positioning Compensation ln order to allow for variations in positioning, larger than the plus or minus 2 mils. called for previously, a compensating network will return the reading spotstothe center ofthe parking area. To accomplish this, the reading lens is mounted on the small XY stage 111 referred to above capable of 1 mil. steps upon command A timing signal is generated at the I beginning of each index command and compared to the time taken to reach the first transition line. Any deviation will generate a pulse in the appropriate direction driving the lens stage. This movement will result in returning the reading spot to the center I the parking area. Compensation in the direction of travel is achieved at each index while compensation in the other axis is derived in a similar manner from the turnaround block at the end of each line as shown in H6. 14. Before the beginning of a complete frame, a manual reset signal will return the lens stage to a start position.

Die Indexer Referring now more particularly to FIG. I, there is shown in detail a die-indcxing apparatus such as may be arrayed at each deposit station 42, as broadly shown in PEG. 1. The die-indexing mechanism of FIG 7 maybe used both to package indlvidual dies as well as to remove dies from the packages for subsequent operations such asbonding, for example. In the illustrated embodiment of PEG. 2, one indexer is located at each deposit station so that each indexer will serve to package dies all having the same qualityand characteristics. I

Used in the indexer is a strip 146, shbwn best in FIG. 8,, comprised of a relatively narrow strip formed with indexirlg holes l42 along one edge, in a manner similar tcifmtwdel'ilm, and storage holes M4 near the other edge of the strip. On the bottom side, a thin, pressuresensitive adhesive tape 146 is laminated to the strip 146 The adhesive tapethus provides an adhesive floor at the bottom of the storage holes 144. The laminated strip is wound on a feed reel 148 which is mounted to the indexer as by a shaft 159 provided on a frame 152. The strip 148 is threaded over an indexing track provided on the indexer to a takeup reel 154.

The indexer includes a sprocket drive 156 and contoured guide plates 158 and 160 which feed the strip 340 onto the upper reach of the indexer before delivering the strip to the rec 254. A motor or solenoid 162 is employed to actuate the indexer. The strip is carried to the upper reach of the indexer where a storage cavity 144 will come into register witha collet and, assuming that the die carried by the collet Si) is addressed for this particular indexer, the die will be deposited in the strip ca ity. A signal will then be generated to the solenoid 162 to advance the strip so that another strip cavity will be brought into position for the next die. As the strip cavities are filled, the strip will be wound up onthe reel 154, which is drivingly connected to the feed reel 148, the two reels rotating in unison. When the strip is completely indexed and eontainsa device in each cavity all of the dies of'he strip will be of the same category.

The indexer, as previously indicated, may be used to remove the dies from the packaging strip as well as to package them. When employed to remove the dies from the strip a reciprocating needle 164 is employed to function in a manner similar to the needle 10?. of FIGS. 5 and 6. This needle is mounted upright to a block 166 supported on parallel springs I63 and 170 and reciprocated by means of a pivotally mounted arm 372 urged downwardly by means of a spring 374 and pivoted upwardly by means of a earn 176. It will be urtderstood that each time the cam 176 is rotated. the arm 172 will pivot upwardly forcing the needle 164 up through the adhesive floor of the strip cavity, forcing the die contained therein upwardly into a vacuum c'ollet such as shown at 80 in H6. 6 which then may be used to transfer the die to a bonding station.

Having thus described the invention what we claim and desire to obtain by Letters Patent of the United States is:

We claim:

l. The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said-devices and obtaining data specifying the characteristics of said devices,

I). eleetro-optically encoding said data on a recording stratum as coded images, one each of said coded images denoting the characteristics of one each of said (56230-5, said coded images arranged in an array related to said monoiithic wafer,

c. dividing said devices'from' one another while maintatning their orientation, and then I d. sorting said devices from one another according to said characteristics as presented by said coded images.

2. The method of claim I wherein said dividing step includes scoring said wafer, mounting said wafer on the adhesive face of a flexible web, .and bending said wafer along the scoreiines to break said devices apart.

3. The method of claim 2 wherein said devices are removed from said web by first displacing a d vice from the plane of said wafer in a direction away from said web by pressure on said web opposite said device and then pulling said device free of said adhesive face.

4. The method of claim '1 including the step of packaging like devices after they have been sorted.

5. The method of claim 1 wherein said encoding steps includes producing projectable coded images corresponding in positional arrangement with said devices.

6. The method of claim 5 wherein said sorting step includes projecting said coded images and converting said images into electrical signals.

7. The method of claim 5 including the step of mounting said projectable images and the divided devices in side-by-side relation.

8. A system for sorting semiconductor devices from a monolithic wafes-ot devices comprising c. a dividing station for dividing said devices while maintaining their orientation,

d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby and e. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations or like devices. 9. A system according to claim 8 including a mounting station for mounting said sheet and the divided wafer in side-by side relation to a common frame.

ill. The method of sorting semiconductor devices f'orn a monolithic wafer ofsaid devices. comprising the steps of a. testing each of said devices and obtaining characteristics signals thereby, I

b. electro-opticaily encoding said signals into recorded instructions and producing projctat le coded images cor responding in positional arrangemegg with said dfifis?" c. dividing said devices from one another while maintaining their orientation,

d. mounting said projcctable images and the divided devices in side-by-side 'eiation, and

e. sorting said devices from one another in accordance with said recorded instructions.

It. A system for sorting semiconductor devices from a monolithic wafer ofdcvices, comprising a. a test station for testing each device to determine its characteristics,

h. an electro-optical encoder operatively connected to said test station for producing on a sheet-coded images containing test data of said devices,

c. a dividing station for dividing said devices while maintaining their orientation.

d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby,

e. a mounting station for mounting said sheet and the divided wafer in side-by-side relation to a common frame,

and

f. a orting station'responsiveto said reading station for separating said devices from said wafergod delivering to collection stations of like devices. 

1. The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said devices and obtaining data specifying the characteristics of said devices, b. electro-optically encoding said data on a recording stratum as coded images, one each of said coded images denoting the characteristics of one eacH of said devices, said coded images arranged in an array related to said monolithic wafer, c. dividing said devices from one another while maintaining their orientation, and then d. sorting said devices from one another according to said characteristics as presented by said coded images.
 2. The method of claim 1 wherein said dividing step includes scoring said wafer, mounting said wafer on the adhesive face of a flexible web, and bending said wafer along the scorelines to break said devices apart.
 3. The method of claim 2 wherein said devices are removed from said web by first displacing a device from the plane of said wafer in a direction away from said web by pressure on said web opposite said device and then pulling said device free of said adhesive face.
 4. The method of claim 1 including the step of packaging like devices after they have been sorted.
 5. The method of claim 1 wherein said encoding steps includes producing projectable coded images corresponding in positional arrangement with said devices.
 6. The method of claim 5 wherein said sorting step includes projecting said coded images and converting said images into electrical signals.
 7. The method of claim 5 including the step of mounting said projectable images and the divided devices in side-by-side relation.
 8. A system for sorting semiconductor devices from a monolithic wafer of devices, comprising a. a test station for testing each device to determine its characteristics, b. an electro-optical encoder operatively connected to said test station for producing on a single sheet coded images containing test data of said devices, c. a dividing station for dividing said devices while maintaining their orientation, d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby and, e. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations of like devices.
 9. A system according to claim 8 including a mounting station for mounting said sheet and the divided wafer in side-by-side relation to a common frame.
 10. The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said devices and obtaining characteristics signals thereby, b. electro-optically encoding said signals into recorded instructions and producing projectable coded images corresponding in positional arrangement with said devices, c. dividing said devices from one another while maintaining their orientation, d. mounting said projectable images and the divided devices in side-by-side relation, and e. sorting said devices from one another in accordance with said recorded instructions.
 11. A system for sorting semiconductor devices from a monolithic wafer of devices, comprising a. a test station for testing each device to determine its characteristics, b. an electro-optical encoder operatively connected to said test station for producing on a sheet-coded images containing test data of said devices, c. a dividing station for dividing said devices while maintaining their orientation, d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby, e. a mounting station for mounting said sheet and the divided wafer in side-by-side relation to a common frame, and f. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations of like devices. 